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IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems
(DFT 2016)
September 19-20, 2016
University of Connecticut, Storrs, CT, USA

http://www.dfts.org/

SUBMISSION DEADLINE EXTENDED TO MAY 7, 2016
CALL FOR PAPERS

Scope

DFT is an annual Symposium providing an open forum for presentations in the field of defect and fault tolerance in digital systems inclusive of emerging technologies. One of the unique features of this symposium is to combine new academic research with state-of-the-art industrial data, necessary ingredients for significant advances in this field. All aspects of design, manufacturing, test, reliability, and availability that are affected by defects during manufacturing and by faults during system operation are of interest.

The topics include (but are not limited to) the following ones:

1.  Yield Analysis and Modeling: Defect/fault analysis and models; statistical yield modeling; critical area and other metrics.

2.  Testing Techniques: Built-in self-test; delay fault modeling and diagnosis; testing for analog and mixed circuits; signal and clock integrity.

3.  Design For Testability in IC Design: FPGA, SoC, NoC, ASIC, microprocessors.

4.  Error Detection, Correction, and Recovery: Self-testing and self-checking design; error-control coding; fault masking and avoidance; recovery schemes, space/time redundancy; hw/sw techniques, architectural-specific techniques, system-level strategies.

5.  Dependability Analysis and Validation: Fault injection techniques and environments; dependability characterization; aging modeling and analysis.

6.  Repair, Restructuring and Reconfiguration: Repairable logic; reconfigurable circuit design; DFT for on-line operation; self-healing; reliable FPGA-based systems.

7.  Defect and Fault Tolerance: Reliable circuit/system synthesis; radiation hardened/tolerant processes and design; design space exploration for dependable systems, transient/soft faults and errors; aging management and recovery strategies.

8.  Fail-Safe Design for Critical Applications: Methodologies and case study applications to automotive, railway, avionics, industrial control, biomedicine, space and smart power networks.

9.  Emerging Technologies: Techniques for CNTs, QCA, DNA, RTDs, SETs, molecular devices and self-assembly.

10. Design for Security: Fault attacks, fault tolerance-based countermeasures, Scan-based attacks and countermeasures, side-channel attack and countermeasures, hardware Trojans, security vs. reliability trade-offs, interaction between VLSI test, trust, and reliability.

Submissions

Prospective authors are invited to submit original and unpublished contributions. Two types of submissions are possible: (i) regular papers (6 pages), and (ii) short papers (4 pages). Both types will be included in the symposium proceedings and should adhere to the IEEE conference template, 2-columns style (available on conference web site), and submitted as PDF file, electronically. Detailed information about the submission process are available on the conference website.

Proposals for special sessions are also invited this year. For more information, visit symposium website.

Key Dates

Paper registration deadline:   April 29, 2016

Paper submission deadline:      May  7, 2016 April 29, 2016

Acceptance notification:            July  1, 2016

Camera ready deadline:            July 22, 2016

Additional Information

General co-chairs:

Program co-chairs:

Industrial liaison chair:

Publicity chair:

Publication co-chairs:

  • Farrukh Hijaz (University of Connecticut, USA)
  • Halit Dogan (University of Connecticut, USA)
Committee

Program Committee

  • L. Anghel, TIMA, FR
  • C. Bolchini, Politecnico di Milano, IT 
  • G. Chapman, Simon Fraser University, US 
  • R. Cideciyan, IBM, CH
  • A. Daniel, Intel Corporation, US
  • J. Dworak, Southern Methodist University, US
  • M. Ebrahimi, KTH Royal Inst.Technology, SE
  • B. Eklow, CISCO, US
  • O. Ergin, TOBB University, TR
  • A. Evans, IROC Technologies, FR
  • M. Fukushi, Yamaguchi University, JP 
  • D. Gizopoulos, University of Athens, GR 
  • J. Han, University of Alberta, CA
  • C. Huang, National Tsing Hua University, TW
  • V. Izosimov, KTH Royal Inst. Technology, SE
  • M. Jenihhin, Tallin Univ. of Technology. EE
  • W. Jone, University of Cincinnati, US 
  • P. Joshi, Cadence, US 
  • A. Kanuparthi, Intel Corporation, US
  • N. Karimi, Rutgers University, US
  • R. Karri, NYU Polytechnic, US
  • Y. Kim, Northeastern University, US 
  • I. Koren, Univ. of Massachusetts-Amherst, US
  • S. Kundu, Univ. of Massachusetts-Amherst, US
  • H. Li, Chinese Academy of Science, CN 
  • F. Lombardi, Northeastern University, US 
  • J. Mathew, IIT Patna, IN
  • C. Metra, University of Bologna, IT 
  • B. Meyer, McGill University, CA
  • M. Mozaffari Kermani, Rochester Inst. Tech.,US
  • K. Namba, Chiba University, JP 
  • N. Nicolici, McMaster University, CA
  • C. Nicopoulos, University of Cyprus, CY
  • M. Ottavi, Univ. of Rome “Tor Vergata”, IT 
  • N. Park, Oklahoma State University, US 
  • I. Polian, University of Passau, DE
  • I. Pomeranz, Purdue University, US
  • S. Pontarelli, Univ. of Rome “Tor Vergata”, IT
  • M. Psarakis, University of Piraeus, GR
  • A. Rahmani, Univ. of Turku, FI
  • P. Rech, UFRGS, BR
  • S. Reda, Brown University, US
  • S. Reddy, University of Iowa, US 
  • P. Reviriego, Universidad Nebrija, ES
  • D. Rossi, University of Southampton, UK
  • F. Salice, Politecnico di Milano, IT 
  • C. Sandionigi, CEA, FR
  • M. Schölzel, Universität Potsdam / IHP, DE
  • I. Sourdis, Chalmers Univ. of Technology, SE
  • V. Sridharan, AMD, US
  • M. Tehranipoor, University of Connecticut, US 
  • N. Touba, University of Texas at Austin, US 
  • S. Tragoudas, S. Illinois Univ Carbondale, US  
  • L. Wang, University of Connecticut, US
  • X. Wen, Kyushu Institute of Technology
  • D. Xiang, Tsinghua University, CN

 

For more information, visit us on the web at: http://www.dfts.org/

The CONFERENCE is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC).


IEEE Computer Society- Test Technology Technical Council

TTTC CHAIR
Chen-Huan CHIANG 
Alcatel-Lucent - USA
Tel. +1-973-386-6759
E-mail chenhuan@alcatel-lucent.com

PAST CHAIR
Michael NICOLAIDIS 
TIMA Laboratory - France 
Tel. +33-4-765-74696 
E-mail michael.nicolaidis@imag.fr

TTTC 1ST VICE CHAIR
Matteo SONZA REORDA
Politecnico di Torino - Italy
Tel.+39 090 7055
E-mail matteo.sonzareorda@polito.it

SECRETARY
Joan FIGUERAS
Un. Politec. de Catalunya - Spain
Tel. +34-93-401-6603
E-mail figueras@eel.upc.es

ITC GENERAL CHAIR
Michael Purtell
Intersil
- USA
Tel. +1-408-372-6015
E-mail m.purtell@ieee.org

TEST WEEK COORDINATOR
Yervant ZORIAN
Synopsys, Inc. - USA
Tel. +1-650-584-7120
E-mail Yervant.Zorian@synopsys.com

TUTORIALS AND EDUCATION
Paolo BERNARDI

Politecnico di Torino
- Italy
Tel. +39-011-564-7183
E-mail paolo.bernardi@polito.it

STANDARDS
Rohit KAPUR

Synopsys
, Inc. - USA
Tel. +1-650-934-1487
E-mail rkapur@synopsys.com

EUROPE
Giorgio DI NATALE
LIRMM - France
Tel. +33-467-41-85-01
E-mail giorgio.dinatale@lirmm.fr

MIDDLE EAST & AFRICA
Ibrahim HAJJ
American University of Beirut - Lebanon
Tel. +961-1-341-952
E-mail ihajj@aub.edu.lb

STANDING COMMITTEES
André IVANOV
University of British Columbia - Canada
Tel. +1-604-822-6936
E-mail ivanov@ece.ubc.ca

ELECTRONIC MEDIA
Giorgio DI NATALE
LIRMM - France
Tel. +33-467-41-85-01
E-mail giorgio.dinatale@lirmm.fr

 

PRESIDENT OF BOARD
Yervant ZORIAN
Synopsys, Inc. - USA
Tel. +1-650-584-7120
E-mail Yervant.Zorian@synopsys.com

SENIOR PAST CHAIR
André IVANOV
University of British Columbia - Canada
Tel. +1-604-822-6936
E-mail ivanov@ece.ubc.ca

TTTC 2ND VICE CHAIR
Rohit KAPUR

Synopsys, Inc.
- USA
Tel. +1-650-934-1487
E-mail rkapur@synopsys.com

FINANCE
Chen-Huan CHIANG
Alcatel-Lucent - USA
E-mail chen-huan.chiang@alcatel-lucent.com

IEEE DESIGN & TEST EIC
André IVANOV
U. of British Columbia - Canada
Tel. +1
E-mail ivanov@ece.ubc.ca

TECHNICAL MEETINGS
Chen-Huan CHIANG
Alcatel-Lucent
- USA
Tel. +1-973-386-6759
E-mail chenhuan@alcatel-lucent.com

TECHNICAL ACTIVITIES
Matteo SONZA REORDA
Politecnico di Torino - Italy
Tel.+39 090 7055
E-mail matteo.sonzareorda@polito.it

ASIA & PACIFIC
Kazumi HATAYAMA
NAIST - Japan
Tel.+81-743-72-5221
E-mail k-hatayama@is.naist.jp

LATIN AMERICA
Victor Hugo CHAMPAC
Instituto Nacional de Astrofisica - Mexico
Tel.+52-22-470-517
E-mail champac@inaoep.mx

NORTH AMERICA
André IVANOV
University of British Columbia - Canada
Tel. +1-604-822-6936
E-mail ivanov@ece.ubc.ca

COMMUNICATIONS
Cecilia METRA
Università di Bologna - Italy
Tel. +39-051-209-3038
E-mail cmetra@deis.unibo.it

INDUSTRY ADVISORY BOARD
Yervant ZORIAN
Synopsys, Inc. - USA
Tel. +1-650-584-7120
E-mail Yervant.Zorian@synopsys.com


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